TL;DR: TSMC plans to increase prices for its 5nm and 3nm process nodes by 5-10% and CoWoS advanced packaging by 15-20% due to high AI demand. These price hikes are expected in January 2025. The 3nm ...

Higgins provided guidance for the December quarter, stating, "Total revenue is expected to be $3.225 billion, plus or minus $150 million." Foundry/logic revenue is forecasted to be about 59% and ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

Chip-giant Intel (NASDAQ: INTC) is dead set on reclaiming its manufacturing edge over foundry leader TSMC. The company's manufacturing roadmap includes launching five nodes in a four-year span.