Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...
Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging ...
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.
SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...
TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...
Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...
Lam Research Corporation (NASDAQ:LRCX) is one of the best performing NASDAQ stocks according to hedge funds. On October 2, the company announced a breakthrough in etch technology. The technology is ...
The Chosun Ilbo on MSN
SK Hynix builds 19 trillion won advanced packaging fab in Cheongju
SK Hynix will invest 19 trillion Korean won to build an advanced packaging fab in Cheongju, North Chungcheong Province. On ...
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