Industry’s first use of ruthenium in high-volume production enables copper chip wiring to be scaled to the 2nm node and beyond and reduces resistance by as much as 25% New enhanced low-k dielectric ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

How data centers are evolving to meet the challenges of AI/ML computing. Pros and cons of common copper and optical interconnect solutions. Benefits of RF transmission over plastic cable (e-Tube) for ...

It's been 20 years since IBM first introduced copper interconnects in CMOS processing, sparking a minor revolution in the process. Within a handful of years, both Intel and AMD had made the jump as ...

The PivotPoint FM1010 high-performance switch chip for board-level system interconnect can deliver 192 Gbits/s of sustained throughput using six SPI 4 phase 2 interfaces. PivotPoint replaces discrete ...

[CONTRIBUTED THOUGHT PIECE] Data centers are in the midst of a rapid transformation to support the increasing number, complexity and size of AI and HPC workloads. As part of that transformation, large ...

Ayar Labs Inc., a startup developing a new way of linking together chips in data centers, today announced that it has raised $25 million from investors. The funding was provided as an extension to a ...

Why AI needs high-speed interconnects. How multichannel fiber meets AI demands. How multichannel fiber support fits on a chip. Though copper provides high-speed connectivity, it has limitations. One ...

Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance by up to 25%.

Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...