SAN JOSE, Calif. — Following possible shortages and supply-chain disruptions in the market, Japan's Shin-Etsu Chemical Co. Ltd. (SEH) has recently increased the prices for its epoxy molding ...
VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...
Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Save ...
The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...
New York, April 25, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "North America Bulk Molding Compounds Market Forecast to 2028 - COVID-19 Impact and Regional Analysis ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
Bulk molding compound (BMC) is a ready-to-mold, glass-fiber reinforced thermoset polymer material used in compression molding, along with injection molding and transfer molding. BMC is manufactured by ...
For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and ...
IACMI Project 3.2 evaluated carbon fiber-reinforced composites infused with a novel epoxy-based resin system to develop structural composite parts with complex geometry to replace metals in ...
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