SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping, which ...
LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...
Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...
No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...
AMD has been granted a patent (12080632) that covers glass core substrate tech. Glass substrates will replace traditional organic substrates for multi-chiplet processors in the coming years. The ...
The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass ...
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