The Spring Pin Socket line allows very high endurance and wide temperature range testing of 0.3mm to 1.27mm pitch BGA, LGA , QFN QFP and SOIC devices on the same footprint as other Ironwood socket ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Series 700, 0518, and 0501 RoHS-compliant sockets are specifically designed for high-pin-count or off-centered components for socketing DIPs with nonstandard row-to-row dimensions and elevating ...
Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
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