Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...
Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
Professor Singisetti at the University at Buffalo discusses the commercialisation path for Gallium Oxide in high-power ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Wolfspeed is bringing the power-handling properties of silicon carbide (SiC) to the renewable energy, energy storage, and high-capacity EV fast-charging sectors with its new family of 2,300-V power ...
Stretchable substrates were fabricated using R2R equipment (A, B), and liquid metal wiring was fabricated using the dispensing process. During substrate fabrication, the material coated at the blade ...
Conductors are materials that allow electric current to flow with minimal resistance and are essential for transmitting power and electrical signals in electronic devices. Most metals are good ...
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