Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei’s (TOKYO:7282) technology to enhance GaN substrates has been verified to improve power device performance. An article confirming it was published in ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

LG Innotek developed the world's first "copper post" technology, a solution needed for the latest smartphones. This technology allows for denser circuitry for smaller, higher-performance semiconductor ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

TL;DR: SKC is advancing glass substrate technology for high-performance semiconductors, collaborating with AMD and Amazon AWS on final quality tests. The company plans to increase production capacity ...

Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology SEMCO's collaboration with AMD focuses on meeting the unique challenges of ...

In context: Manufacturers are trying to develop novel chip substrate technologies to save Moore's law and keep crunching the Megahertz rates up. Glass is the most promising material for next-gen ...

Today’s electronic device market is characterized by two conflicting demands: more power, less space. As users come to expect ever more capabilities from ever smaller electronics, electrical engineers ...