The new funding will help CoolSem Technologies advance its wafer-level thermal management technology, improving heat ...
Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
Researchers at the National Energy Technology Laboratory (NETL), Cerebras showed that a single wafer-scale Cerebras CS-1 can outperform one of the fastest supercomputers in the US by more than 200 X.
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