Semiconductor Engineering

Wafer Probe Struggles To Adapt To Multi-Die Assemblies

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
Seeking Alpha

Aehr Announces New Customer and Initial Order for FOX-XP™ Multi-Wafer Test and Burn-in System for Volume Production of Silicon Carbide MOSFETs

FREMONT, Calif., June 01, 2023 (GLOBE NEWSWIRE) -- Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and production burn-in equipment, today announced a new silicon carbide ...
Morningstar

Aehr Test Systems and ISE Labs Announce Partnership on Wafer-Level Test and Burn-in for High-Performance Computing and Artificial Intelligence Processors

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE ...
Nasdaq

Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...
Digi Times

TSMC’s top wafer testing partner posts 78% surge as new facility ramps

Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated ramp of a ...
Semiconductor Engineering

Detecting Slips, Scratches, Cracks In Wafers And Dies Becoming Harder

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection tools’ resolution and throughput at foundries and OSATs. However, defects ...