LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
With advances in new technology it is getting more important to monitor all aspects of the influencing parameters in critical etch steps and utilize them as tuning knobs for within-wafer uniformity ...
The fundamentals of a good Bosch etching system are described below; There are a number of significant features of the equipment used for Bosch processing which differ from normal ICP systems: In ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely transformed plasma etch technology and system solution, designed to ...
AZoMaterials interviews Matt Wilding about how the EP-Replayer enables users to simulate previous etch runs in real time, helping them optimize End Point detection methods, and more. Can you start by ...
Etching is a process that removes unwanted material from a wafer, which is also known as a "slice" or "substrate." Wafers are made of semiconducting material such as crystalline silicon and are used ...
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