Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

KLA Instruments™, a division of KLA Corporation, has expanded its defect inspection and metrology portfolio in 2023 to include new systems for semiconductor process development and control, including ...

Aurora Solar Technologies' founder and COO Gordon Deans tells PV Tech how inline measurement and monitoring can protect yield, prevent process excursions and ultimately, ensure maximum profitability ...

Silicon wafers are processed by adding dielectric films, which are primarily utilized to isolate circuits and offer mechanical and chemical protection to the device. These films also serve as masking ...