After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...

FREMONT, Calif., Feb. 09, 2022 (GLOBE NEWSWIRE) -- Lam Research Corp. (NASDAQ: LRCX) today announced a new suite of selective etch products that apply breakthrough wafer fabrication techniques and ...

(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

What Is Etching In Semiconductor Manufacturing? In semiconductor manufacturing, etching is a crucial process that sculpts the intricate circuits on a silicon wafer. It works by selectively removing ...

(Nanowerk News) Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes ...

It's a mistake to assume wafer clamp rings have to polyimide. Several other work about as well. Silicon wafers aren't the only things that lose material in the various etching steps of IC ...

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective ...