Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...

Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated ...