PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...

PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

TAIPEI, Taiwan--(BUSINESS WIRE)--Dow Electronic Materials today introduced the OPTIVISION TM 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over pad ...

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

LONDON — Linx Consulting LLC is predicting that demand for pads and slurries will drive the annual market for chemical mechanical polishing (CMP) consumables up 12 percent to $1.23 billion in 2006, up ...

Thomas West Inc. (TWI) introduced a hard chemical mechanical planarization (CMP) pad today that will put the small, privately owned Sunnyvale, Calif.-based company up against Rodel Inc., a company ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

Copyright AD-TECH; licensee AZoM.com Pty Ltd. This is an AZo Open Access Rewards System (AZo-OARS) article distributed under the terms of the AZo-OARS https://www ...