LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

With advances in new technology it is getting more important to monitor all aspects of the influencing parameters in critical etch steps and utilize them as tuning knobs for within-wafer uniformity ...

Chemical Resistance: UniversityWafer's fused silica, sapphire and glass wafers are chemically inert, ensuring they won't react with the reactive gases typically used in dry etching processes. This ...

OSAKA, Japan — Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the ...

Etching is a method employed during the fabrication of semiconductors to chemically remove layers from the surface of the wafer substrate. Etching is a crucial process, and each wafer is subject to ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

Etching is a process that removes unwanted material from a wafer, which is also known as a "slice" or "substrate." Wafers are made of semiconducting material such as crystalline silicon and are used ...